I have a question in regard to the curing of L.P.I.  
soldermasks.  Many people cure their screened boards thermally only, 
with no U.V. "bump".  Other people insist that the additional U.V. 
cure is needed to make the mask stronger 'pencil strength scale".  
Some people claim that the amount of hardness that the U.V. cure adds 
is so insignifigant to a properly thermally cured board, that it is a 
waste of valuable time to perform this operation.  I am looking for 
some input on what other people have found in regard to this issue and would 
greatly appreciate any feedback that I can get.  Thank you.

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