Hi Peter,
 We have been using reflowed SN/PB on our PWA for several years and have
found that it works very well with Fine pitch as well as chip
components.
Hector Valladares
Honeywell Space Systems
813-539-3683

> ----------
> From: 	peter dahlen[SMTP:[log in to unmask]]
> Sent: 	Tuesday, July 08, 1997 10:41 AM
> To: 	[log in to unmask]
> Subject: 	ASSEM
> 
> 
> Hello,
> 
> I have some questions regarding PCB for data and microwave
> applications
> which I hope someone will give me some good inputs to.
> 
> Questions:
> 
> I would like to have some inputs abut solderability, shelf lifte etc.
> by
> using different surface treatment onto the cu-pattern on a PCB. Your
> experience by using:
> 
> a.	HAL
> b.	Reflowed Sn/Pb
> c.	Unreflowed Sn/Pb
> d.	Electroless nickel/gold
> e.           Organic passivation
> f.	Other
> 
> And above surface treatments in combination with:
> 
> a.	Surface mounted chip components
> b.	Surface mounted fine-pitch IC
> c.	"Standard" hole mounted components 
> 
> 
> Best Regards
> 
> Peter Dahlén
> 
> Saab Ericsson Space
> [log in to unmask]
> fax. +46 31 359520
> 
> 
> 
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