I am also working on feasibility of PIP process and shall appreciate to
have info on these atricles and and other additional information.
In case,Siu can fax me info if contacted directly.
My fax is 204-257-9104.
ashok dhawan


> ----------
> From: 	Steve Siu[SMTP:[log in to unmask]]
> Sent: 	July 30, 1997 3:52 PM
> To: 	[log in to unmask]
> Subject: 	BGA and Pin-in-Paste
> 
> Hello,
> 
> Thank you for the input on BGA and Pin-in-Paste Process.  I have 
> also found a two-parts article in June and July 97 IPC REVIEW 
> magazine.  The paper is "Ball Grid Array, MicroBGA, Chip Scale 
> Packaging, and 0.4mm Ultra-Fine Pitch Implementation at U.S. 
> Robotics". 
> 
> Could anyone tell me where I could get a copy of the followings:
> 
> 1.  "Developing the Paste-in-hole Process", Tom Grevascio, Group 
>      Technologies, Surface Mount International Proceedings, 1994 or 
>      Circuit Assembly, Oct. 1995.
> 
> 2.  "Through Hole Connector Soldering with Solder Paste Reflow", Bill 
>      Barthel, Electronic Assembly Corp., Surface Mount International 
>      Proceedings, 1994.
> 
> My fax number is (604) 291-1567.
> 
> Thanks a lot.
> 
> Steve Siu
> Manufacturing/Design Engineer
> Pachena Industries Ltd. 
> 
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