Hello Everybody,

Is there a guideline on the recommended geometry of adhesive for optimum
performance on SMT components?  A customer posed this question to me in
reference to a D-PAC type device.  I am not familiar with this package type
so it you can provide some background like what it looks like, footprint,
etc. I would be most appreciative.  

I would also like to thank everyone who responded to my request about
MIL-F-14256.  I received about 20 responses and all were very helpful and
most informative.  Thanks again to the entire technet!

Denis Meloche
Heraeus Cermalloy
610-825-6050
Fax 610-825-7061

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