Subject: | |
From: | |
Date: | Thu, 31 Jul 1997 09:42:40 -0400 (EDT) |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
In a message dated 97-07-30 16:39:05 EDT, you write:
>
> 1. "Developing the Paste-in-hole Process", Tom Grevascio, Group
> Technologies, Surface Mount International Proceedings, 1994 or
> Circuit Assembly, Oct. 1995.
>
You might try Teresa Gentry at Circuits Assembly - her e-mail is
[log in to unmask]
> 2. "Through Hole Connector Soldering with Solder Paste Reflow", Bill
> Barthel, Electronic Assembly Corp., Surface Mount International
> Proceedings, 1994.
>
Bill Barthel, EAC, can be reached at 414-751-3651.
Doug Pauls
CSL
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|