Steve:
(1) Contact SMTA at 612-920-7682
(2) Contact the authors directly. I know that Bill Barthel at EAC/PLEXUS 
has updated his paper, and has also presented it at several SMTA chapter 
meetings (You should be able to get contact information from SMTA also)
(3) If all else fails, e-mail back to me and I'll see if I can find them 
in our library and fax them to you. 

Jack Crawford, IPC 847.509.9700 x 393

On Wed, 30 Jul 1997, Steve Siu wrote:

> Hello,
> 
> Thank you for the input on BGA and Pin-in-Paste Process.  I have 
> also found a two-parts article in June and July 97 IPC REVIEW 
> magazine.  The paper is "Ball Grid Array, MicroBGA, Chip Scale 
> Packaging, and 0.4mm Ultra-Fine Pitch Implementation at U.S. 
> Robotics". 
> 
> Could anyone tell me where I could get a copy of the followings:
> 
> 1.  "Developing the Paste-in-hole Process", Tom Grevascio, Group 
>      Technologies, Surface Mount International Proceedings, 1994 or 
>      Circuit Assembly, Oct. 1995.
> 
> 2.  "Through Hole Connector Soldering with Solder Paste Reflow", Bill 
>      Barthel, Electronic Assembly Corp., Surface Mount International 
>      Proceedings, 1994.
> 
> My fax number is (604) 291-1567.
> 
> Thanks a lot.
> 
> Steve Siu
> Manufacturing/Design Engineer
> Pachena Industries Ltd. 
> 
> ***************************************************************************
> * TechNet mail list is provided as a service by IPC using SmartList v3.05 *
> ***************************************************************************
> * To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
> * with <subject: subscribe/unsubscribe> and no text in the body.          *
> ***************************************************************************
> * If you are having a problem with the IPC TechNet forum please contact   *
> * Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
> ***************************************************************************
> 

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************