TECHNET Archives

July 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
[log in to unmask] (Taylor Michelle Bodziak)
Date:
Wed, 30 Jul 1997 19:32:00 -0400
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (29 lines)
TechNet:

Is it legal to use plating thiefs during copper plate?  Tape or Designed
in open areas?  Where do you put them?

What is the IPC code?

What about stamped out copper shielding in front of and attached to the
panels?  Has this been tried?

Are there any computer programs that will simulate plating fields to a
specified design?

Many Thanks,  

Taylor Michelle
[log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************


ATOM RSS1 RSS2