Hello,

Thank you for the input on BGA and Pin-in-Paste Process.  I have 
also found a two-parts article in June and July 97 IPC REVIEW 
magazine.  The paper is "Ball Grid Array, MicroBGA, Chip Scale 
Packaging, and 0.4mm Ultra-Fine Pitch Implementation at U.S. 
Robotics". 

Could anyone tell me where I could get a copy of the followings:

1.  "Developing the Paste-in-hole Process", Tom Grevascio, Group 
     Technologies, Surface Mount International Proceedings, 1994 or 
     Circuit Assembly, Oct. 1995.

2.  "Through Hole Connector Soldering with Solder Paste Reflow", Bill 
     Barthel, Electronic Assembly Corp., Surface Mount International 
     Proceedings, 1994.

My fax number is (604) 291-1567.

Thanks a lot.

Steve Siu
Manufacturing/Design Engineer
Pachena Industries Ltd. 

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