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Subject:
From:
"Charles Elliott" <[log in to unmask]>
Date:
30 Jul 1997 12:01:32 U
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        Reply to:   RE>ASSY - Water soluble solder pastes and component bake

Bonjour Patrick,

Please refer to J-STD-020 for baking of components that are moisture sensitive
(after they have been exposed past their floor life).  The component suppliers
tend to specify the time and temperature for baking on each label.  Humidity
is absorbed / removed from a component at different rates.  

Hope this helps.  Bonne chance.
Charles Elliott
NPI Process Engineering
Newbridge Networks
[log in to unmask]

--------------------------------------
Date: 1997.07.30 10:55 AM
To: Charles Elliott
From: Patrick Ducas

Does anybody have a specification for these particular topics :

- Time allowed between water soluble paste printing and reflow ?
- Time allowed between reflowed PCB assembled with waters soluble solder
paste and the cleaning operation ?

Is there a different specification between the different types or activity
of organic fluxes? If it so, what is it? Is it a problem if we double
reflow th PCB (double sided board) before the cleaning? Depending on the
quantity of a giving lot, the time between the first printing and the
cleaning operation may be long (see couple of hours, the cleaning machine
is not in line with the SMT machines), that why I'm interested to know if
there is a spec.  

Also, does anybody have a specification for the baking operation to prevent
or eliminate moisture in plastic components (IC, QFP, BGA, etc...). Is
there a relationship between the exposure time in humidity vs baking time
or is there a fixed set of temperature and time parameters?

Thanks in advance, it would be very appreciated if someone could share any
specification or recommendation. 
       
-------------------------------------------------
Patrick Ducas
Process Quality Engineer 
Matrox Electronic Systems Ltd
E-mail: [log in to unmask]
TŽl:(514)969-6000 ext.2971   Fax:(514)685-3415
-------------------------------------------------
  		

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Subject: ASSY - Water soluble solder pastes and component bake
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