hello
                                                                        
    
we are facing a wave solderability  problem of cleaned ,from either
paste or adhesive,  misprinted osp        (entek 106)coated packs.The
cleaned packs are usually double reflow processed in N2 atmosphere -no
       clean process and then exposed to water based no clean flux in
N2 wave soldering process                    
Those reworked packs shows poor via wettability during wave soldering.
                                               
can you recommend a cleaning procedure & materials that will clean paste
and smut adhesives from the pack without causing any damage to the sop
layer the pre soldered devices.
         

                                                 
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