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July 1997

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Subject:
Hole Fill
From:
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Date:
Tue, 29 Jul 1997 09:36:03 -0400 (EDT)
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Several years ago (10 to 15) a fellow named Roger Wild at the IBM Federal
Systems Div. conducted a test to assess the effect of hole-fill (solder) on
the reliability of plated through holes.  As I recall the test consisted of
subjecting pwb's with varying degrees of hole-fill to multiple thermal cycles
and monitoring the failure rate during thermal cycling.  Can anyone lead me
to a source where I can get a copy of the report on this test.  Thanks in
Advance.  Jim Moffitt

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