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Date: | Tue, 29 Jul 1997 08:54:07 -0400 |
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Hello Colleagues
One of my favorite 'smaller-is-better' design Engineers found a Nanionics
connector which uses 30 AGW wire for thru-hole leads, and recommends a thru
hole diameter of 12-16 mils. (Tight tolerance, too, huh?)
Question: Has anyone had problems with soldermask being left in these small
holes. The alleged failure mode is from the LPI-developer not able to
develop out soldermask in these holes, due their small diameter. This is
reasonable, since LPI developing likes alot of impingement.
I am looking for individuals who can commiserate, and who may have worked
out an alternative.
Other topic we could also talk about is holding a +/- .002 hole size with
solder coating; HASL?; Plate and reflow?; Ni/ Immersion Gold?
Finally, who in the Board industry told Nanionics this was an 'easy' thing
to do? (just kidding)
George Franck
Raytheon E-Systems
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