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July 1997

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Subject:
From:
GeoFranck <[log in to unmask]>
Date:
Tue, 29 Jul 1997 08:54:07 -0400
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Hello Colleagues
One of my favorite 'smaller-is-better' design Engineers found a Nanionics
connector which uses 30 AGW wire for thru-hole leads, and recommends a thru
hole diameter of 12-16 mils.  (Tight tolerance, too, huh?)
Question:  Has anyone had problems with soldermask being left in these small
holes.  The alleged failure mode is from the LPI-developer not able to
develop out soldermask in these holes, due their small diameter.  This is
reasonable, since LPI developing likes alot of impingement.
I am looking for individuals who can commiserate, and who may have worked
out an alternative.
Other topic we could also talk about is holding a +/- .002 hole size with
solder coating; HASL?; Plate and reflow?; Ni/ Immersion Gold?


Finally, who in the Board industry told Nanionics this was an 'easy' thing
to do?  (just kidding)

George Franck
Raytheon E-Systems

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