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July 1997

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Subject:
Mixed Technologie SMD-Soldering + COB
From:
Jeremias Michael <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Mon, 28 Jul 1997 22:49:08 -0700
Content-Type:
text/plain
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text/plain (33 lines) 
We are assembling SMD components.
--soft soldering tinlead with noclean solder paste on Dycostrate Au
--wash with  ethyl alcohol.

--Then  AgEpoxy  die attachement COB -- curing

-- Then  US bonding Al Wedge, wedge
-- Then TS bonding Au Wedge, wedge

Some wedges lift of  !!!!!!!!.

Do You know means in production  for protect Au  surface against flux ,
or clean surface after soldering  by what ?  

Experiences with plasma cleaning?

Thank You for help



M. Jeremias

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