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July 1997

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Subject:
Re: Gold peel after solder level
From:
[log in to unmask] (Paul A Galatis)
Date:
Sun, 27 Jul 1997 11:26:47 -0500
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Andy,

If you found Ni on both sides of the peel it was probably caused by high
pH in the Ni plating bath, usually with the help of a current
interruption.  Hope this helps.

Paul Galatis

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