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Date: | 25 Jul 1997 10:53:36 -0800 |
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Subject: Time: 10:41 AM
GEN:cost analysis and model Date: 7/25/97
Hi:
I need some help on new project for cost analysis of board fabrication and
assembly. I will focus on build up technology, multilayer high density flex
fabrication and assembly (BGA, C4,...etc.). Can anyone recommend or share the
source or vendor for following information:
* book, paper, literature
* cost model
* consultant
* source for data
Thanks
Bill Chou
Fujitsu Computer Packaging Technologies,Inc.
[log in to unmask]
(408)943-7721
fax: (408)943-7790
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