To whomever responded to Steve Siu, please identify where you may be
contacted.
Thanks,
Stu Korringa
Smiths Industries, Grand Rapids, Mi.
616-241-8189
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: Re: BGA and Paste-Insert-Reflow
Author: <[log in to unmask]> at SMTPpost
Date: 7/25/97 7:27 AM
Steve,
The July 1997 Journal of SMTA Technology ,volume 10, issue 3, has an
excellent article on this issue (contact them at phone 612-920-7682). And,
SMT magazine, February 1997 issue includes an article on this subject. Also,
AMP connector company has good info, including formulas, on their homepage
at www.amp.com/products/articles
We have implemented PIH technology with good success.If you would like more
info, contact me offline.
At 05:01 PM 7/24/97 -0800, you wrote:
>Hello,
>
>Our company is currently investigating the paste-insert-reflow
>(PIR) process, aka "pin hole reflow", "intrusive reflow". It is
>basically reflowing thru-hole component with SMT technology.
>We are interested in applying PIR process to board with BGA
>component on one or both sides. Any input is deeply appreciated.
>Thanks.
>
>Regards
>Steve Siu
>Manufacturing Design Engineer
>
>
----------------------------------
Jeff L. Hempton phone: (219) 429-7335 Fax: (219) 429-4688
Boardshop Manufacturing Engineer Mail Stop: 25-31
Hughes Defense Communications
1010 Production Road, Fort Wayne, IN 46808-4106
Email: [log in to unmask]
"The man who rolls up his sleeves seldom loses his shirt."--Thomas Cowan
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