Steve,
The July 1997 Journal of SMTA Technology ,volume 10, issue 3, has an
excellent article on this issue (contact them at phone 612-920-7682). And,
SMT magazine, February 1997 issue includes an article on this subject. Also,
AMP connector company has good info, including formulas, on their homepage
at www.amp.com/products/articles
We have implemented PIH technology with good success.If you would like more
info, contact me offline.  

At 05:01 PM 7/24/97 -0800, you wrote:
>Hello, 
>
>Our company is currently investigating the paste-insert-reflow 
>(PIR) process, aka "pin hole reflow", "intrusive reflow".  It is 
>basically reflowing thru-hole component with SMT technology.
>We are interested in applying PIR process to board with BGA 
>component on one or both sides.  Any input is deeply appreciated.     
>Thanks.  
>
>Regards
>Steve Siu
>Manufacturing Design Engineer
>
>
----------------------------------
Jeff L. Hempton        phone: (219) 429-7335   Fax: (219) 429-4688
Boardshop Manufacturing Engineer			Mail Stop: 25-31
Hughes Defense Communications                           
1010 Production Road, Fort Wayne, IN 46808-4106
Email: [log in to unmask]

"The man who rolls up his sleeves seldom loses his shirt."--Thomas Cowan

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************