Denis Meloche asked for published literature on Sn62 vs Sn63 
solders in a thermal cycle environment.  The following 
article may be of interest, also I believe the authors have
put out a few other papers on the same subject.

Cheers,
	Andy

----------


Author(s) AU:  Pao, Y.H.
                   Badgley, S.
                   Govila, R.
                   Jih, E.
  Affiliation AF:  Ford Motor Company, Dearborn, MI, USA
        Title TI:  Experimental and modeling study of thermal cyclic behavior
                   of Sn-Cu and Sn-Pb solder joints
      Journal JN:  Materials Research Society Symposium Proceedings
       Source SO:  Electronic Packaging Materials Science VII Mater Res Soc
                   Symp Proc v 323 1994 Publ by Materials Research Society
                   Pittsburgh PA USA p 153-158
    ISSN/ISBN IS:  1558992227
                   02729172
  Record Type RT:  CA (Conference Article)
   Conference CI:  Proceedings of the Fall 1993 MRS Meeting
                   11/29-12/03/93
                   Boston, MA, USA
    Conf Code CO:  20330
     Language LA:  English
   Subject(s) SU:  Soldering alloys
                   Soldering
                   Thermal effects
                   Thermoanalysis
                   Finite element method
                   Fatigue of materials
                   Thermal cyclic behavior
                   Sn Cu solder joint
                   Sn Pb solder joint
     Abstract AB:  Thermal cyclic shear stress/strain hysteresis response of
                   97Sn-2Cu-0.  8Sb-0.2Ag, 95.5Sn-4Cu-0.5Ag, 63Sn-37Pb, and
                   62Sn-36Pb-2Ag solder joints have been determined using a
                   double beam specimen. The temperature cycle had a period of
                   40 minutes and extreme temperatures of 40oC and
                   140oC. The steady state creep properties of these
                   solders were determined, and associated Norton's law was
                   implemented in a finite element program to simulate the
                   experiment. The fatigue life of these solders joints and
                   failure mechanism are also discussed.
                   (Author abstract)
                   12 Refs.
 Class. Codes CC:  538.1.1
                   801.4
                   921.6
 Date Indexed DI:  9410


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