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July 1997

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Subject:
BGA and Paste-Insert-Reflow
From:
"Steve Siu" <[log in to unmask]>
Date:
Thu, 24 Jul 1997 17:01:57 -0800
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Hello, 

Our company is currently investigating the paste-insert-reflow 
(PIR) process, aka "pin hole reflow", "intrusive reflow".  It is 
basically reflowing thru-hole component with SMT technology.
We are interested in applying PIR process to board with BGA 
component on one or both sides.  Any input is deeply appreciated.     
Thanks.  

Regards
Steve Siu
Manufacturing Design Engineer

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