Jason:

(The following text was sent to you directly at [log in to unmask]   I 
received a "undeliverable message" response so I am posting this on 
Tech-Net. Let me know if I have the correct e-mail address.)

I am strictly involved with manufacturing of printed circuit cards and other 
electronic assemblies so I can only give you practical information.

We have never been able to use LCC's of any configuration where the boards 
are exposed to any thermal cycling. The differences in the TCE (Thermal 
Coefficient of Expansion) between the board substrate,(whether glass, 
polyimide, or otherwise) and the LCC caused cracked solder joints when 
temperature stressed.

We, as a course of standard practice, send our LCC's out to North Penn 
Technology for the attachment of compliant "J" leads to the LCC's. This 
solved all of our TCE mismatches and were able to complete thermal cycling 
without any solder cracking problems.

The address for North Penn is 2294 North Penn Road, Hatfield, PA 19440. 
Their phone number is 215-997-3200.

Bill Kasprzak
Moog Inc.
716-652-2000 ext 2507
[log in to unmask]

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