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July 1997

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Subject:
DES
From:
Jason R Witt <[log in to unmask]>
Date:
Wed, 23 Jul 97 8:19:32 EDT
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I am looking for information regarding LCC reliability. We are in the process 
of redesigning a board and are considering using 20pin or 28pin LCCs but can 
find no comparison studies on the two of them for thermal cycling, as will as 
attachment methods (attached leads or solder pedestals). Any information or 
practical experience would be appreciated. Thank you.


Jason Witt
Boeing Defense & Space Group
(770) 497-5025
[log in to unmask]

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