LaVern-
Glass filled epoxy is 6 BTU*in/(h*in*ft^2*deg F), ASTM method C-177; For
comparison, polyimide is 6.8
Also:
Epoxy resin for PWB 0.14 BTU/h*FT*deg F),
Polyimide for PWB 0.14 BTU/h*FT*deg F)
[both data from "Electronic Materials & Processes Handbook", Eds.
Charles Harper & Ronald Sampson, 2nd Ed.1993, McGraw-Hill Inc.
ISBN 0-07-054299-6
TK7836.E4653 1993
621.381--dc20)
Thermal analysis articles in ASME's Transactions on Electronic Packaging
may also be a good source of PWB thermal properties.
Michael Alderete
Aerojet
Azusa, CA
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+++++++++++++++++++++++++++++++++++++++
+++++++++++++++++++++++++++++++++++++++
From: lmullet[SMTP:[log in to unmask]]
Sent: Tuesday, July 22, 1997 2:34 PM
To: TechNet
Subject: ,pDES:FR-4 Thermal Conductivity
Can anyone tell me what the "Thermal Conductivity" is for FR-4 material?
Where can I find this info? and what FR-4 materials, if any, are better
suited to transfer heat?
Thank you, in advance, for your responses!
LaVern Mullet
Thomas & Betts
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