Subject: | |
From: | "ADAMS, Mike" <"LI/LIAUROR2/ADAMSM%Lucas Aerospace"@MCIMAIL.COM> |
Date: | Tue, 22 Jul 1997 11:10:55 -0400 (EDT) |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Ken,
I am investigating the use of a thermally conductive, electrically
insulating adhesive material to bond a pwb to an aluminum plate. I have tried
the Arlon Thermabond adhesive and would like to talk to you more on this
subject.
Either contact me off-line or at (216)995-1195 x3058. I would appreciate it.
Thanks,
Mike Adams
Lucas Aerospace
[log in to unmask]
----------
From: TechNet
Sent: Tuesday, July 22, 1997 9:31 AM
To: Multiple Addresses Suppressed
Cc: BROMLEY, Bill; MASTORIDES, John; ADAMS, Mike
Subject: ASSY:PCB/heatsink lamination
---------------------------------------------------------------------------
MCI Mail date/time: Tue Jul 22, 1997 2:39 pm GMT
Source date/time: Tue, 22 Jul 1997 09:31:18 -0700
-------------------
---------------------------------
Forwarded message
Date: Tue Jul 22, 1997 6:12 am GMT
Source-Date: Tue, 22 Jul 1997 10:12:05 -0400
From: "Devitt, Ken"
EMS: INTERNET / MCI ID: 376-5414
MBX: [log in to unmask]
TO: "[log in to unmask]"
EMS: INTERNET / MCI ID: 376-5414
MBX: [log in to unmask]
Subject: ASSY:PCB/heatsink lamination
Message-Id: 97072214395068/INTERNETGWDI2IG
Source-Msg-Id:
<[log in to unmask]>
U-X-Mailer: Microsoft Exchange Server Internet Mail Connector Version
4.0.994.63
U-Old-Return-Path: <[log in to unmask]>
U-X-Mailing-List: <[log in to unmask]> archive/latest/14191
U-X-Loop: [log in to unmask]
U-Precedence: list
I am looking for alternate bonding films/sheet adhesive systems for
bonding a PCB to a heatsink. The adhesive system has to be thermally
conductive, electrically insulating, and capable of "decoupling" the CTE
mismatch between the PCB and heatsink .
We currently are using Arlon's Thermabond(TM) and laminate after
assembly.
Are there any recommendations for alternates?
Ken Devitt
ITT Avionics
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]> *
* with <subject: subscribe/unsubscribe> and no text in the body. *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask] *
***************************************************************************
|
|
|