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July 1997

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Subject:
Re: GEN: SMOBC vs Reflower Tin/Lead
From:
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Date:
Fri, 4 Jul 1997 10:04:57 -0400 (EDT)
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In my opinion, both processes give the board a temperature
extreme that is not a great idea. This is especially true when
you have to go to a few reflows for surface mount comps.
The best idea is not to reflow or hot solder dip.  Go with an
organic coating.
Also, there is hot oil reflow, horizontal and vertical hasl, and
other such operations which if not controlled for time, temp, etc.
you can get a weak board.

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