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July 1997

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Subject:
From:
"Max Bernhardt "<[log in to unmask]>
Date:
Tue, 22 Jul 1997 07:20:00 -0500
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In TSOP packages it can make your life miserable.  We had some memory
modules that gave us fits until the vendor finally switched over to a
Copper lead frame.  If you look at the technet archives, you will find a
huge discussion on this issue.
 ----------
From: Gabriela Bogdan
To: [log in to unmask]
Subject: ALLOY 42
Date: Friday, July 18, 1997 2:35PM


Hi, TechNetters !
I am alive and still hoping to get comments on Alloy 42 concerning the
quality
of solder joints ,pro and con's,if possible.I sent a message a week ago.

I wish to have sent a question about wedge voids too, but learned a lot
about
it ,unexpectedly.
Thank you all,
Gaby
P.S.:I have 2 e-mails:
[log in to unmask]
[log in to unmask]

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