TECHNET Archives

July 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: ASSY: BGA Mounting
From:
Gary Woodford <[log in to unmask]>
Date:
Tue, 22 Jul 1997 07:23:13 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (27 lines) 
Hi Christy

Why not use blind micro-vias they allow the free placement of components
on either side of a board and can also be placed in the solder pads
without adversely effecting soldering due too their small size.
This would give you the complete freedom of design.

You might look at http://www.dyconex.com which has large sections
devoted to micro-via design.

Regards

Gary Woodford
Rigid and Flex
Northants UK

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

ATOM RSS1 RSS2