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July 1997

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Subject:
DES: Thermal Vias
From:
"Urry, John @ SLG" <[log in to unmask]>
Date:
Mon, 21 Jul 97 16:26:00 mdt
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I am looking for help determining recommended dimensions for thermal vias   
and thermal via legs (spokes).  I understand there is a trade-off between   
making the vias large enough with small enough legs to allow the board to   
be soldered without the use of a blast furnace versus making the vias   
smaller with larger legs to allow for the required current capacity of   
the connection.  Any suggestions would be most appreciated.

John Urry
L3 Communications
Salt Lake City, UT

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