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July 1997

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Subject:
DES: Thermal Vias
From:
"Urry, John @ SLG" <[log in to unmask]>
Date:
Mon, 21 Jul 97 15:09:00 mdt
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I am looking for help on determining recommended dimensions for thermal   
vias and thermal via legs (spokes).  I understand there is a trade-off   
between making the vias large enough with small enough legs to allow the   
board to be soldered without the use of a blast furnace versus making the   
vias smaller with larger legs to allow for the required current capacity   
of the connection.  Any suggestions would be most appreciated.

John Urry
L3 Communications
Salt Lake City, UT  

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