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July 1997

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Subject:
Gold - copper diffusion
From:
[log in to unmask] (Allan H. Reed)
Reply To:
[log in to unmask]
Date:
Mon, 21 Jul 1997 14:07:44 -0400 (EDT)
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Dejen, 
See the paper by Mort Antler of Bell Labs in Plating, vol 57,
page 615(1970) for a definitive study on copper diffusion
through gold without a nickel barrier layer.
Allan Reed
Technic Inc.

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