Hi, 

I guess you should try to check if the wave-solder pot is being contaminated.
Sometimes, it might due to contamination in the pot, there is solder-bridging
on the smaller chip components such as 0805 or 0603..

Good Luck


Poh

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At 11:44 AM 7/18/97 PDT, Nachbor, Suzanne (MN51) wrote:
>
>We have 0805 chip components with bridging occurring (underneath) after wave 
>soldering. 1206 chips placed on the same board with approximately twice the 
>adhesive volume do not show any bridging.  We have been using this 
>component, adhesive, adhesive dot size, and footprint  for years and never 
>had this problem.  The only change that has occurred is our pick and place 
>equipment.  The default on the new equipment was to place the chip at 3.5N 
>force.  The old one placed at approximately 2N force (this value is highly 
>suspect).   We are in the process of doing some testing with placement of 
>the chips at different forces to see if this might be our problem.  We are 
>also looking at the adhesive material and cure times, etc.  Has anyone else 
>observed similar problems? 

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