Depending on the type of resist being used, I believe post development hold
times can impact copper peelers, especially in a process that uses no/low
microetch in preplate cleaning.  

In such a process, the acid soak clean is usually expected to remove any
residual resist or components from the adhesion promoters that may remain on
the copper surface after developing.  In a continuous flow process, this is
usually not a problem.  If the panels are allowed to sit around for a couple
of days or more, the residues present may continue to "lock-in" to the
copper, to a degree that would require a microetch to remove.  If not
removed, these residues could cause copper peelers.

A marginal developing process would further exacerbate the problem, by
leaving more residue than would be found in a robust developing situation.
 Again, copper peelers is the likely result.  The situation would also be
worse if you are using a resist that has a strong adhesion system, such as a
good general purpose resist, or one designed for harsh plating environments.

I would guess that high humidity/temperature would not affect plating.
 Oxidation would be the result of storage under those situation, but I'm not
sure peelers would result.

Hope this helps.

Mark Dowding
Regional Technical Specialist
Insulectro

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