We have 0805 chip components with bridging occurring (underneath) after wave 
soldering. 1206 chips placed on the same board with approximately twice the 
adhesive volume do not show any bridging.  We have been using this 
component, adhesive, adhesive dot size, and footprint  for years and never 
had this problem.  The only change that has occurred is our pick and place 
equipment.  The default on the new equipment was to place the chip at 3.5N 
force.  The old one placed at approximately 2N force (this value is highly 
suspect).   We are in the process of doing some testing with placement of 
the chips at different forces to see if this might be our problem.  We are 
also looking at the adhesive material and cure times, etc.  Has anyone else 
observed similar problems? 

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************