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July 1997

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Subject:
Re: FAB: Copper Peelers
From:
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Date:
Thu, 17 Jul 1997 18:57:20 -0400 (EDT)
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jim -

there is a difference between low copper adhesion - UNDERPLATE - and poor
copper adhesion. Check exposing to meet parameters - check strength of
developing solution - Check pressure spray on developer - Check actual
nozzles - Check breakpoint on developer - Check cleaner - Check condition of
copper bath - without definite info as to what is occurring - hard to come up
with a pinpointed answer. Hope this helps.

Regards

Richard Fudalewski
Atotech Canada Ltd

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