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July 1997

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Subject:
RE: DES: tented vias
From:
"Robert Welch" <[log in to unmask]>
Date:
Thu, 17 Jul 1997 16:07:28 +0000
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I agree with Tom also.   Converting old dry film jobs to Via plugging 
has become a common practice.  The better the documentation the 
better the chance you will get what you wanted.
 
Beware that all the design rules still apply you must now allow for 
clearance between surface mount pads and a screened on ink, (which is 
why we typically prefer to  plug on the the solder side with green 
thermal ink). 
Robert E. Welch
Process Specialist
Email: [log in to unmask]
Modem: 804-239-9120
Fax:   804-237-3048

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