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July 1997

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Subject:
From:
Mike Buetow <[log in to unmask]>
Date:
Wed, 2 Jul 1997 12:06:24 -0500 (CDT)
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (55 lines)
J-STD-012, Implementation of Flip Chip and Chip Scale Technology, is a 
jointly (IPC, EIA, MCNC, Sematech) produced document published January 1996.

It describes design considerations, assembly processes, technology 
choices, application, and reliability data. Includes: flip chip, HDI, 
microBGA, micro SMT, and SLICC.

To order, contact the IPC Order Deptartment at the phone number below, 
or at [log in to unmask] Price: $35 IPC members; $70 nonmembers.

Mike Buetow
IPC Staff
2215 Sanders Road
Northbrook, IL 60062
P: 847-509-9700
F: 847-509-9798
[log in to unmask]


On Sun, 2 Jul 1995, david yeh wrote:

> Hi,
> 
> Can anyone tell me is there a IPC specification for Flip Chip ???
> 
> Many thanks!!!
> 
> 
> Best regards,
> David Yeh,
> Process & Development Engineer
> Seagate Technology
> 
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