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July 1997

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Subject:
From:
Lenny Kurup <[log in to unmask]>
Date:
Wed, 16 Jul 1997 14:17:49 -0400 (EDT)
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TEXT/PLAIN (81 lines)
Hi Matt,

The problem of wedge void formation is, in most cases attributable to the
oxide process, little, if any blame can be ascribed to "shotty" drilling.
The oxide layer thickness is a key parameter to consider when trouble
shooting, as well as lamination settings such as shifts in planarity,
temp., pressure and even contamination issues, etc. Your description of
possible causes matches what we have experienced, and, corrective actions
have always resulted in process improvements. The pink-ring problem, indeed
only appears after wet processing.

Lenny Kurup
Technical Representative
EMX ENTERPRISES LTD.

On Tue, 15 Jul 1997 [log in to unmask] wrote:

>      We found that a reduced oxide helped quite a bit.  This means that the 
>      inner layer processing is involved in the formation of wedge voids.  
>      I'll bet that lamination cycles can adversely affect the boards too.  
>      Drilling is, of course involved, & wet process brings out the defect.
>      
>      What problems do you have with reduced oxide?
>      
>      Matt Byrne
>      HADCO-Owego
> 
> 
> ______________________________ Reply Separator _________________________________
> Subject: Re: Mechanism of Wedge Void Formation
> Author:  [log in to unmask] at SMTPLINK-HADCO
> Date:    7/15/97 06:37 AM
> 
> 
> wedge voids are usually a start of shotty drilling - then seepage of solution 
> through the voids and that solution then starts attacking oxide layer - which 
> inturn leads to pinkring. Dm will not make a difference - actually if 
> drilling is still primary cause - will be the same or worse - since Dm is 
> thinner coating. A reduced oxide layer can eliviate problem to a certain 
> degree - but then - reduced oxide brings in a problem of it's own.
>      
> regards
>      
> Richard Fudalewski
>      
> Atotech Canada
>      
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