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July 1997

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Subject:
RE: FAB : tented vias
From:
"Kenny, James" <[log in to unmask]>
Date:
Wed, 16 Jul 1997 9:44 -0800
Content-Type:
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A tented via relates to dry film soldermask. The dry film is applied to   
the whole panel, but some selected vias are not exposed or developed off.   
This method completely encapsulates the via. Most shops have moved away   
from the dry film soldermask technology because the same end result can   
be obtained through LPI with via capping. The LPIs have better SIR and   
Ionic cleanliness properties, and are more robust.
 ----------
From:  Engineering / Design Dept.[SMTP:[log in to unmask]]
Sent:  Wednesday, July 16, 1997 11:38 AM
To:  jamesken; davidbo; technet
Subject:  FAB : tented vias


Can anybody explain what a tented via is?

Thanks

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