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July 1997

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Subject:
From:
"Charles Elliott" <[log in to unmask]>
Date:
16 Jul 1997 11:35:02 U
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        Reply to:   RE>Wave and BGA

Bonjour Andre,

This is a legitimate concern.  The best way of finding out is to thermocouple
the balls under the BGA and go through your wavesolder process.  Also, keep in
mind the potential for popcorning (delamination) if the BGA's are PBGA type.

Hope this helps.  Bonne chance.
Charles Elliott
NPI Process Engineering
Newbridge Networks
[log in to unmask]

--------------------------------------
Date: 1997.07.16 11:22 AM
To: Charles Elliott
From: Andre Bisson
Hello all,

I will like to have comment on any effect that a wave can do on a BGA.

We have some boards with BGA on component side and many component on the
solder
side. Our process will be reflow component side, glue solder side, install all
TH
parts and go to wave. 

Is anyone had or have  problems with BGA (solder joints problem) after wave?
Our
via's are half tented with solder masks and the trace connecting the via to
the
BGA pad is approx. 0.020"-0.030".

My concerns are:

- Re-reflow of BGA solder ball causing cold solder or any solder defect?
- Reliability problems?
- Etc.

Any advice will be well appreciated.

Thank you.

Andre Bisson
CAE Electronics
[log in to unmask]

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Subject: Wave and BGA
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