Hi;

  I am trying to locate information which can establish the reliability/performance aspects of through-hole solder joints as a function of hole to lead ratios. The IPC has set three different levels for Plated through hole diameter to lead diameter relationships, (levels A, B and C per table 5-15 in IPC-D-275). Has any work been done which relate these different levels to joint performance and reliability? If anyone can provide either data or reference any published reports it would help. Thanks in advance for any assistance.

Russ Krawczyk
[log in to unmask]
Sr. Materials Engineer
MICRO SWITCH
Freeport IL.

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