Hello all,

I will like to have comment on any effect that a wave can do on a BGA.

We have some boards with BGA on component side and many component on the solder
side. Our process will be reflow component side, glue solder side, install all TH
parts and go to wave. 

Is anyone had or have  problems with BGA (solder joints problem) after wave? Our
via's are half tented with solder masks and the trace connecting the via to the
BGA pad is approx. 0.020"-0.030".

My concerns are:

- Re-reflow of BGA solder ball causing cold solder or any solder defect?
- Reliability problems?
- Etc.

Any advice will be well appreciated.

Thank you.

Andre Bisson
CAE Electronics
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