Masterbond in Hackensaack, NJ also makes an epoxy stripper that works fairly
well epecially with epoxy potted or encapsulated assemblies.   It makes the
epoxy flake off rather than swelling it (swelling tends to interfere with
failure analysis by causing additional damage) .   It's not as aggressive on
metal subsrates as the nitric acid method.  Try them at 201-343-8983.   

Sheila


At 09:31 AM 7/16/97 -0700, you wrote:

Joseph Fjelstad wrote:
>> 
>> Hi folks!
>> 
>> Does anyone have a favorite formula for removing the molded plastic from
>> around the IC and lead frame for failure analysis?
>> 
>> Thanks in advance to all who reply...
>> 
>> Best to all,
>> J. Fjelstad
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>Hi,Joseph!
>
>3 decapsulation methods are known to me ,which work well depending
>on your appliccation.
>1."Automatic" decapsulation ,done with the decapsulators from
>B&G Enterprises,Inc.
>2880 Research Park Drive,Suite 100
>Soquel,CA 95073
>408.464.6540
>Fax 408.464.6549
>They have several models for almost all types of packaging.
>I have no experience with their product.
>2.Nitric acid , manually.This is ART and needs some experience.
>3.Dipping in adequate solvents from
>Dynaloy,Inc.
>7 Great Meadow Lane
>Hanover N.J.07936
>(201)887-9270
>This is done also manually,and Dynaloy has a booklet on the subject.
>Good luck!
>GABY
>
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>

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