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July 1997

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Tue, 15 Jul 97 15:58:03 EST
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     We found that a reduced oxide helped quite a bit.  This means that the 
     inner layer processing is involved in the formation of wedge voids.  
     I'll bet that lamination cycles can adversely affect the boards too.  
     Drilling is, of course involved, & wet process brings out the defect.
     
     What problems do you have with reduced oxide?
     
     Matt Byrne
     HADCO-Owego


______________________________ Reply Separator _________________________________
Subject: Re: Mechanism of Wedge Void Formation
Author:  [log in to unmask] at SMTPLINK-HADCO
Date:    7/15/97 06:37 AM


wedge voids are usually a start of shotty drilling - then seepage of solution 
through the voids and that solution then starts attacking oxide layer - which 
inturn leads to pinkring. Dm will not make a difference - actually if 
drilling is still primary cause - will be the same or worse - since Dm is 
thinner coating. A reduced oxide layer can eliviate problem to a certain 
degree - but then - reduced oxide brings in a problem of it's own.
     
regards
     
Richard Fudalewski
     
Atotech Canada
     
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