TECHNET Archives

July 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Joseph Fjelstad <[log in to unmask]>
Date:
Tue, 15 Jul 1997 09:47:57 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (33 lines)
Hi folks!

Does anyone have a favorite formula for removing the molded plastic from
around the IC and lead frame for failure analysis?

Thanks in advance to all who reply...

Best to all,
J. Fjelstad
*************************************************************************
    _/_/_/_/  /__  __/ / ____/ / ___/ / ___/  / ___/  / __  /    / \  
   _/_/_/_/     / /   /       /___   /___    /       / __  /    / _ \
  _/_/_/_/     / /   / __/       / /    /   / __/   / / \ \    / ___ \
 _/_/_/_/     /_/   /_____/  /____/ /____/ /_____/ /_/   \_\  /_/   \_\

 ...System Building Blocks for the Next Generation of Electronics
 
 3099 Orchard Drive
 San Jose, CA 95134
 Phone 408 894-0700
 Fax   408 894-0768

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************


ATOM RSS1 RSS2