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July 1997

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Date:
Tue, 15 Jul 1997 09:52:40 -0400 (EDT)
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Hello Mr. Lee

We have seen a similar problem in different PCB shops. The problem is that
the soldermask reacts with the copper surface (oxides) and forms the "shield"
during the baking. 

It is possible to analyze the copper surface by SERA technique prior to the
HASL operation. If the instrument detects the soldermask residue, it means
that your precleaning operation is not sufficient enough.

If you have more questions about analysis, please let me know.

Best regards
Michael Pavlov
ECI Technology
1 Madison st.
E. Rutherford, NJ 07011
(201) 773-8686

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