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July 1997

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Subject:
From:
Angel Luis Ferrandez Berrueco <[log in to unmask]>
Date:
Mon, 14 Jul 1997 12:59:00 -0700
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Dear collegues:

I would apreciate very much if anyone inform me about equipment makers for wire
bounding, flip chip, & chip on board
process technology. Also if you know any book or any article about this matter.

Thanks in advance for your help.

Angel Ferr ndez
Process engineer ([log in to unmask])

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