Hi Vikcha and Thomas,
Most likely the lack of responses comes from the large number of questions to
which there are no real good clear cut answers. I can only address the solder
joint issue. Just with manual visual inspection, these AOI machines are not
capable "to verify 100 % solder joint integrity", because the very concept of
'100 % solder joint integrity' is faulty. Visual criteria, inspected manually
or with AOI are incapable of this since the inspection criteria do not exist.
Visual inspection flagged many cosmetic variations that had nothing to do
with solder joint integrity or reliability and because of the following
rework reduced overall quality. 
My recommendation is to use AOI to flag solder joints that show anomalies
from some standard range of 'expectable' variations, that can then be
inspected visually or by other means.  
The biggest quality-based threat to solder joint integrity and reliability in
inadequate wetting, which in most cases cannot be seen by visual or AOI
indications. The other threat to solder joint reliability is inadequate
design, which can in no case be found by inspections.

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 973-543-2747
E-mail: [log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************