Hi Jamey,
Off-hand, I do not really see a problem with what you propose. The 63/37
tin-lead solder plating will have formed some copper/tin intermetallic
compounds (more if the plating has been reflowed less if not) with the lead
concentrated together with the remaining tin near the surface. In contact
with the wave the plated/reflowed solder will melt and essentially be swept
away, more copper/tin IMC will be formed and the solder joint will be
essentially all 96.5/3.5 silver-tin solder. You may want to follow Dave
Hillman's advice to make sure my opinion holds.

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 973-543-2747
E-mail: [log in to unmask]

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