Hi there,

Is anynoby in PCB assemblers using Sn43/Pb43/Bi14 solder paste as primary
or secondary process (to reflow heavy components on double-sided PCBs)??

Is it enough reliable. Having in mind that is it a non-eutectic alloy ,
will the rework be a challenge vs Sn63/Pb37 and how is the post-reflow
inspection ? What is the recommended surface finish of the PCB to achieve
proper wetting results? Would HASL finish be acceptable to support or wett
the solder? Is there intermetallic formation at the joint Pb/Sn/Bi and HASL
finish? How is the strength between both?

I saw a article in the september 1996 publication of SMT MAGAZINE but I
need comments from assemblers. If you have any documentations or documented
works (qualification, reliability test results as thermal cycling, thermal
shock, humidity cycling and X-section & surface analysis for that alloy vs
Sn/Pb would be very appreciated.

I know that there is a lot of answers asked, thanks in advance for your
responses and your sharing.

Regards.       
-------------------------------------------------
Patrick Ducas
Process Quality Engineer 
Matrox Electronic Systems Ltd
E-mail: [log in to unmask]
Tél:(514)969-6000 ext.2971   Fax:(514)685-3415
-------------------------------------------------
  		

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************