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July 1997

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Fri, 25 Jul 97 08:43:48 -0500
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     To whomever responded to Steve Siu, please identify where you may be 
     contacted.
     
     Thanks,
     Stu Korringa
     Smiths Industries, Grand Rapids, Mi.
     616-241-8189
     [log in to unmask]


______________________________ Reply Separator _________________________________
Subject: Re: BGA and Paste-Insert-Reflow
Author:  <[log in to unmask]> at SMTPpost
Date:    7/25/97 7:27 AM


Steve,
The July 1997 Journal of SMTA Technology ,volume 10, issue 3, has an 
excellent article on this issue (contact them at phone 612-920-7682). And, 
SMT magazine, February 1997 issue includes an article on this subject. Also, 
AMP connector company has good info, including formulas, on their homepage 
at www.amp.com/products/articles
We have implemented PIH technology with good success.If you would like more 
info, contact me offline.  
     
At 05:01 PM 7/24/97 -0800, you wrote: 
>Hello, 
>
>Our company is currently investigating the paste-insert-reflow 
>(PIR) process, aka "pin hole reflow", "intrusive reflow".  It is 
>basically reflowing thru-hole component with SMT technology.
>We are interested in applying PIR process to board with BGA 
>component on one or both sides.  Any input is deeply appreciated.     
>Thanks.  
>
>Regards
>Steve Siu
>Manufacturing Design Engineer
>
>
----------------------------------
Jeff L. Hempton        phone: (219) 429-7335   Fax: (219) 429-4688 
Boardshop Manufacturing Engineer                        Mail Stop: 25-31 
Hughes Defense Communications                           
1010 Production Road, Fort Wayne, IN 46808-4106 
Email: [log in to unmask]
     
"The man who rolls up his sleeves seldom loses his shirt."--Thomas Cowan
     
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