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Date: | 11 Jul 1997 11:40:43 U |
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Subject: ASSY: Encapsulant/underfill of TSOP 1997.07.1111:33 AM
Hi TechNetters,
I am posting this on behalf of a co-worker who is investigating the
reliability of TSOP solder joints. I understand that the leadframe material
(Alloy42 vs Cu) and particular geometry of TSOPs reduces the board level
reliability (relative to other leaded devices). We intend to include an
"encapsulated/underfilled" TSOP in the study.
Any recommendations as to which type of material to use to restrain the solder
joints ? If you have a specific material which you have used, this would be
of interest (spec, name, etc). Is it better to underfill the complete
component (my opinion) or only the joints ?
Thanks in advance.
Charles Elliott
NPI Process Engineering
Newbridge Networks
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